三星电子高管:明年 HBM 将占 DRAM 芯片制造商总晶圆产能的近 30%

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• ReadhubObserved: Sep 29, 2026Source reliability: 60%

  三星电子高管:明年 HBM 将占 DRAM 芯片制造商总晶圆产能的近 30%. 三星电子高管表示,明年 HBM 将占 DRAM 芯片制造商总晶圆产能的近 30%,当前该占比约为 20%。

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