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SK 海力士扩大存储半导体倒装芯片封装外包规模,继 OSAT 厂商 A-PROTECH 后,新增 WINPAC 为外包商。WINPAC 完成 P Campus 封装工厂相关准备后已启动 DDR4、DDR5 DRAM 量产,该工厂负责 DRAM、NAND Flash 及 eUFS 等高性能产品封装,近期其月产能从 4400 万颗提升至 5000 万颗。
What RADAR observed and classified to build this opportunity. It is what the source published, not a verification that the offer is still active.
SK 海力士向 WINPAC 追加外包存储半导体封装业务. SK 海力士扩大存储半导体倒装芯片封装外包规模,继 OSAT 厂商 A-PROTECH 后,新增 WINPAC 为外包商。WINPAC 完成 P Campus 封装工厂相关准备后已启动 DDR4、DDR5 DRAM 量产,该工厂负责 DRAM、NAND Flash 及 eUFS 等高性能产品封装,近期其月产能从 4400 万颗提升至 5000 万颗。
Open sourceThe catalog shows persisted RADAR opportunities. Storage availability does not mean sources are verified or offers are active.