Skip to content

A little signal. Less noise.

DISCOVER

Catalog Categories

CATEGORIES

Categories will appear when the source is connected.

More possibility. Less searching.

A considered collection of AI tools, trials, and opportunities.

RADAR / PostgreSQLConnection pending

ExploreCatalog

A little signal. Less noise.

Loading the catalog…

RADARGood tools open new possibilities.Explore thoughtfully. Create freely.

Skip to content

A little signal. Less noise.

DISCOVER

Catalog Categories

CATEGORIES

Categories will appear when the source is connected.

More possibility. Less searching.

A considered collection of AI tools, trials, and opportunities.

RADAR / PostgreSQLStorage available

ExploreOffer details

A little signal. Less noise.

Back to catalog

英

英特尔专利提出在CPU封装中集成微型LED 可点亮芯片表面文字

cnBeta.COM.TW

About this offer

英特尔一项近期公开的专利展示了将微型LED直接集成到芯片封装中的方案。专利于2022年提交,描述半导体芯片与微型LED共同嵌入玻璃基板,并通过玻璃通孔(TGV)输送电力和信号。微型LED可直接连接芯片,也可通过纳米线连接;相关线路穿过玻璃基板后,再经封装基板接至主板。阅读全文

Offer details

Provider: cnBeta.COM.TW
Source: cnbeta-tw-rss
Score: 53.49
Confidence: 49%

Source evidence

What RADAR observed and classified to build this opportunity. It is what the source published, not a verification that the offer is still active.

cnBeta TaiwanObserved: Sep 30, 2026Source reliability: 50%
英特尔专利提出在CPU封装中集成微型LED 可点亮芯片表面文字. 英特尔一项近期公开的专利展示了将微型LED直接集成到芯片封装中的方案。专利于2022年提交,描述半导体芯片与微型LED共同嵌入玻璃基板,并通过玻璃通孔(TGV)输送电力和信号。微型LED可直接连接芯片,也可通过纳米线连接;相关线路穿过玻璃基板后,再经封装基板接至主板。阅读全文
Open source

英特尔专利提出在CPU封装中集成微型LED 可点亮芯片表面文字

Opens an external website. Availability and terms may change.

RADARGood tools open new possibilities.Explore thoughtfully. Create freely.

Real offers. Useful details.

The catalog shows persisted RADAR opportunities. Storage availability does not mean sources are verified or offers are active.